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AbbreviationsVV4饊餢( 9I& mCA@. Exemptions; #>LeadframeMaterials; @MoistureSensitivity;(1:PlatingMaterials;0 :!Material Composition Declaration *Supplier or Manufacturing Site Information Response Date 4/15/2015Contact Name Angela Le Contact TitleQS/DCC Engineer Contact Phone86-21-50802030Contact Email/Faxangela_le@giantec-semi.comCompany NameGiantec Name of person certifying Frank zhouCertifying TitleQRA DirectorCertifying PhoneCertifying EmailFrank_Zhou@giantec-semi.com Part CategoryIC Part NameEEPROMPackage FamilyMSOP Pin countPart wight (mg)Part Number(s)GT24CXXAlternative Recommended ItemNAAlternative Item NameAvailability Date Alternative Part Comments!Manufacturing Process Information0Terminal Plating/Grid Array Material CompositionTerminal Plating Thickness (um)7.5~17Terminal Base AlloyA194J-STD-020 MoistureMaximum Reflow Temp. 260 CMaximum temp. duration (sec)Maximum cycles for ReflowComment' Homogeneous Material )3rd Party Analytical Testing result (ppm)Compliance (Yes/No)- 3rd Party Analytical TestingMSDSItemNameVenderTypeWeight (mg)Cd PbHgCr-VIPBBsPBDEsDEHPBBPDBPDIBPRoHSJIG Level AExempt Lab. Name Report No.Date1.RoHS 2.Halogen3.PFOS/PFOADIESMICSiliconN.D.YesNoCTIA2220522292101005 Leadframe Y踲A194+AgNDYESSGSETR22903693M01 ETR22903695M01Die attach paste%f8l鶹S502 TSNEC2201361701 TSNEC2201361703 Copper WireMKECu/PdCANEC2208861607Molding compoundSD CEL-9220HF!SHAEC22003258315 SHAEC22003258316$Lead finish (Matte Sn) on leadframeHTBJ TinTSNEC2201040501Giantec fill in&Supplier or Manufacturing Site fill in"Final Compliance Judgement of RoHS"Substance Composition Declaration JIG Substance GW(峣r(嵧懴慗/E% ir(峘S;`蛻蠎 ~vR詋LevelCategoryCASPPM-Nq\ Y踲OtherCu 7440-50-8 Fe 7439-89-6 7439-92-1P 7723-14-0Zn 7440-66-6Ag 7440-22-4ArcylateTrade secretCuring agent & hardener Silver powderPd(20)otherCEL-9220 Epoxy Resin 1 Epoxy Resin 2 Epoxy Resin 3Phenol ResinCarbon black 1333-86-4Amorphous silica 60676-86-0Crystal silica 14808-60-7Sn 7440-31-5other Silicon 7440-21-3Si/Al Giantec fill in!Termination Material Composition: Leadframe (Underplate) Material:ValueDescriptionPure matte tin=100% Sn (matte) - no Ni barrier or annealing (Heat treatment)Alloy 42Iron-based leadframe materialPure matte tin annealedE100% Sn (matte), annealed is a heat treatment (e.g. 150C for 1 hour)CopperCu, C194, C151, C7025Pure matte tin reflowedS100% Sn (matte), reflowed indicates plating was completely melted after applicationBeryllium CopperBe/CuPure matte tin - Ni barrierK100% Sn (matte), a nickel layer is added between the plating and base metalBrassCu/Zn alloyPure matte tin - Ag barrierK100% Sn (matte), a silver layer is added between the plating and base metalPhosphor BronzeP-BronzePure matte tin fused?100% Sn (matte), fusing is a reflow operation in a hot oil bathNickelNi (Used as barrier layer)-Pure matte tin - reflowed over Nickel barrier-100% Sn (matte), reflowed over a nickel layerKovarIron/Nickel based materialPure bright tin>100% Sn (bright) - no Ni barrier or annealing (Heat treatment)'Other - please give details in CommentsTo specify on Comment columnPure bright tin annealedF100% Sn (bright), annealed is a heat treatment (e.g. 150C for 1 hour)Pure bright tin reflowedT100% Sn (bright), reflowed indicates plating was completely melted after applicationRoHS Exemptions:Pure bright tin - Ni barrierL100% Sn (bright), a nickel layer is added between the plating and base metalPure bright tin - Ag barrierL100% Sn (bright), a silver layer is added between the plating and base metal@Mercury in compact fluorescent lamps not exceeding 5 mg per lampPure bright tin fused@100% Sn (bright), fusing is a reflow operation in a hot oil bath2a[Mercury in straight fluorescent lamps for general purposes not exceeding halophosphate 10mg.Pure bright tin - reflowed over Nickel barrier.100% Sn (bright), reflowed over a nickel layer2boMercury in straight fluorescent lamps for general purp<�oses not exceeding triphosphate with normal lifetime 5 mgSemi-matte tinH100% Sn, material properties fall in between matte and bright conditions2cmMercury in straight fluorescent lamps for general purposes not exceeding triphosphate with long lifetime 8 mgNickel/Palladium/GoldNi/Pd/Au:Mercury in straight fluorescent lamps for special purposesNickel/PalladiumNi/Pd>Mercury in other lamps not specifically mentioned in this listTin/Silver/CopperSn/Ag/CuOLead in glass of cathode ray tubes, electronic components and fluorescent tubesHot Dipped Tin/Silver/Copper-Sn/Ag/Cu applied in a molten tin bath process6aJLead as an alloying element in steel containing up to 0.35% lead by weight Tin/SilverSn/Ag6bNLead as an alloying element in aluminium containing up to 0.40% lead by weightHot Dipped Tin/Silver*Sn/Ag applied in a molten tin bath process6c;Lead as a copper alloy containing up to 4.0% lead by weight Tin/CopperSn/Cu7atLead in high melting temperature type solders (i.e. lead-based solder alloys containing 85 % by weight or more lead)Hot Dipped Tin/Copper*Sn/Cu applied in a molten tin bath process7c?Lead in electronic ceramic parts (e.g. piezoelectronic devices)Tin/Copper annealed;Sn/Cu, annealed is a heat treatment (e.g. 150C for 1 hour)Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparationsTin/LeadSn/PbgHexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigeratorsTin/Lead/SilverSn/Pb/Ag9a!DecaBDE in polymeric applicationsNickel/GoldNi/Au9b-Lead in lead-bronze bearing shells and bushesTin/BismuthSn/Bi,Lead used in compliant pin connector systemsSilver/PalladiumAg/PdALead as a coating material for a thermal conduction module c-ringSilver/Palladium - Ni barrierAAg/Pd, a nickel layer is added between the plating and base metal13a Lead in optical and filter glassSilver - Ni barrierC100% Ag, a nickel layer is added between the plating and base metal13b#Cadmium in optical and filter glassGold100% AuLead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weightGold over Nickel!Au plated over a Ni-barrier layerLead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages100% NiN/ANot ApplicableImmersion SilverImm. Ag Immersion TinImm. SnElectroplated Silver100% AgMoisture Sensitivity:OSPOrganic polymer over copperHot Dipped Tin,100% Sn applied in a molten tin bath processZinc100% Zn or Zn-alloyTin/ZincSn plated over ZnAluminum100% AlIndium alloyIn bearing alloyTin/Copper HASLSn/Cu Hot Air Solder LeveledENIG!Electroless Nickel Immersion Gold5aENEPIG7Electroless Nickel/Electroless Palladium/Immersion Gold'Other - Please give details in CommentsTo specify on Comment columnANR0Affected (by moisture exposure), no JEDEC ratingNMSNot Moisture Sensitive)IPC/JEDEC J-STD-020C; go to www.jedec.orgVt 羳%I d褚MbP?_*+%&篭.椝邂?'篭.椝邂?(呺Q?)篭.椝邂?"3XX兞`?兞`?&U}{}{}{}{}s{}s {} {} {} {}{}s {}] {}{}s{}D{}D{} {tJuvvJJY ,uJww *****;; 6 }6~~~~~~~~~~~~~~~~~~~~~~~~ ) 5 6 * + ,,,, 5 7 6888 - ~ 9 @: #;;@ % 繠<<<` ( ! " . # = $6>>>>>> % ~ @ & ' ( / 0)1112 */~ ? + 9,a - ~ $@ . ~ @ /& 2 0 134 2? @3? 4 5 6 7 8 9 : ; <� = > ? @ A B C D E F G H I J K L ~ ? M N O~ !? 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